KUALA LUMPUR, 8 Dec – Universiti Teknologi Malaysia (UTM) and Infineon Technologies Asia Pacific Pte. Ltd. strengthened their long-standing collaboration today with the signing of a Memorandum of Agreement (MoA) and the official launch of the UTM–Infineon Innovation Launchpad (UIIL). Organised by the Faculty of Artificial Intelligence (FAI), the event underscores UTM’s commitment to advancing Malaysia’s innovation ecosystem, promoting industry–academia partnerships, and nurturing high-impact research and talent development.

The event opened with a welcome address by Professor Dr. Mohd Shafry Mohd Rahim, Vice-Chancellor of UTM, who highlighted the vital role of academia–industry collaboration in driving innovation and equipping students with industry-relevant skills. He emphasised that partnerships with global technology leaders like Infineon provide opportunities for UTM students and researchers to develop real-world solutions in artificial intelligence, semiconductor technologies, and power electronics. The Vice-Chancellor added that such initiatives align with Malaysia’s aspiration to become a regional leader in high-tech innovation, while preparing future engineers and innovators to tackle global challenges.

Following this, Mr. Goh Say Yeow, Vice President of Infineon Technologies Asia Pacific, reaffirmed Infineon’s long-term commitment to Malaysia’s talent development and research landscape. He noted that the partnership with UTM enables hands-on training, joint technology development, and knowledge-transfer programmes—critical for nurturing skilled professionals in artificial intelligence, embedded systems, and semiconductor applications.

The ceremony was officiated by Yang Berhormat Datuk Technologist Mustapha Sakmud, Deputy Minister of Higher Education, who commended UTM for emerging as a national hub for artificial intelligence. He expressed pride in UTM’s alignment with Malaysia’s AI agenda, as outlined by the Prime Minister, and remarked that the establishment of the UIIL reflects UTM’s dedication to fostering innovation, collaboration, and talent development in high-tech sectors. He encouraged the university to continue expanding its contributions to the nation’s knowledge-driven economy.

The MoA was signed by Professor Dr. Mohd Shafry Mohd Rahim, witnessed by Professor Technologist Dr. Intan Zaurah Mat Darus, Deputy Vice-Chancellor (Academic and International). Representing Infineon, Mr. Goh Say Yeow signed the agreement, with Mr. Chung Wei Hoe, Senior Director (Sales and Business Development) serving as witness. The signing ceremony concluded with an exchange of tokens of appreciation and a photography session to mark the strengthened partnership.

Located at Menara Razak, Level 3, the UTM–Infineon Innovation Launchpad (UIIL) will serve as a collaborative hub for research, prototyping, knowledge transfer, and multidisciplinary innovation. The launchpad brings together UTM researchers, Infineon specialists, and students to explore emerging technologies and co-develop practical solutions. During the launch, students showcased live demonstrations of their AI and semiconductor-related projects, illustrating how theoretical knowledge is translated into practical applications with real-world impact.

A top-management meeting followed the launch, focusing on the next phase of collaboration in robotics, automation, and embedded systems. Infineon shared the potential of its PSoC (Programmable System-on-Chip) technology—featuring programmable analog and digital blocks, ARM Cortex processing, and ML-enabled PSoC Edge controllers—to support advanced robotics, intelligent sensing, motor control, and automation research. Both parties agreed to introduce structured knowledge-transfer programmes and specialised PSoC-based training at UTM Johor to strengthen academic integration and develop industry-ready talent. The session concluded with a rooftop group photo, symbolising the shared commitment to future innovation.

The UTM–Infineon partnership reflects UTM’s dedication to developing future-ready engineers and innovators. Through the MoA and the launch of the UIIL, both institutions reaffirm their commitment to high-impact research, technological advancement, and nurturing Malaysia’s next generation of innovators. This milestone reinforces UTM’s position as a key contributor to Malaysia’s high-tech and AI-driven agenda while supporting Infineon’s strategic objectives in the region. The collaboration demonstrates how academia and industry can work together to strengthen the nation’s innovation ecosystem and prepare a skilled workforce for a rapidly evolving technological landscape.

Welcome Remarks from the Vice-Chancellor, Professor Dr. Mohd Shafry Mohd Rahim 

YB Datuk Ts. Mustapha Sakmud delivering his opening speech

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MoA Signing Ceremony 

Signing Ceremony of UTM–Infineon Innovation Launchpad (UIIL) 

YB Datuk Ts. Mustapha Sakmud inside the UILL with Robots from UTM

Demonstration of an AI Project by UTM student  using PSoC from Infineon

UTM Top Management with Infineon Technologies Delegation

Source: UTM NewsHub